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United States Patent 5,808,274
Lee Sept. 15, 1998
Method of cutting masking sheet to be used to process silicon wafer

Abstract

A method of cutting away the unnecessary portions of a masking sheet bonded to a silicon wafer during the IC manufacturing process. The method uses a laser cutting device which includes an optical fiber containing silver halide and a CCD camera to control the position of the laser focal point.

Inventors: Lee; Masahiro (Obu, JP).
Assignee: Teikoku Taping System Co., Ltd. (Tokai, JP).
Appl. No.: 684,006
Filed: Jul. 19, 1996

Foreign Application Priority Data
Jul. 15, 1996 [JP] 8-205416
Intl. Cl. : B23K 26/02
Current U.S. Cl.: 219/121.72; 219/121.83; 219/121.85
Field of Search: 219/121.67, 121.68, 121.69, 121.72, 121.78, 121.81, 121.83, 121.85, 121.73; 264/400; 156/248, 250, 267, 272.8
References Cited | [Referenced By]
U.S. Patent Documents
4,443,684Apr., 1984Sakuragi et al. 219/121.68
4,522,679Jun., 1985Funakoshi et al. 156/267 X
4,568,407Feb., 1986Barbieri et al. 156/510
4,584,455Apr., 1986Tomizawa 219/121.68
4,779,497Oct., 1988Lee 83/16
4,832,444May, 1989Takahashi et al. 385/117
4,851,061Jul., 1989Sorkoram 219/121.67 X
4,865,677Sept., 1989Matsushita et al. 156/248 X
4,910,377Mar., 1990Matsutani et al. 219/121.68 X
4,925,515May, 1990Yoshimura et al. 156/250
4,998,005Mar., 1991Rathi et al. 219/121.83
5,168,141Dec., 1992Tashijan et al. 219/121.83 X

Foreign Patent Documents
58-168488Oct., 1983JP 219/121.83
60-86292May, 1985JP
61-284926Dec., 1986JP
62-144890Jun., 1987JP
3-107317May, 1991JP
4-261900Sept., 1992JP
6-270099Sept., 1994JP
7-241688Sept., 1995JP
91/04828Apr., 1991WO 219/121.73
Primary Examiner: Mills; Gregory L.
Attorney, Agent or Firm: Morgan, Lewis & Bockius LLP
4 Claims, 4 Drawing Figures
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