| United States Patent | 5,826,330 |
| Isoda, et. al. | Oct. 27, 1998 |
Abstract
In a method of manufacturing a multilayer printed wiring board including an internal wiring circuit formed on a board, an insulating resin layer formed on the internal wiring circuit, a blind hole formed in the insulating resin layer and communicating with the internal wiring circuit, and a conductive portion formed on an inner wall of the blind hole and connected to the internal wiring circuit, the blind hole is formed by using a short-pulse CO(2) laser.
| Inventors: | Isoda; Satoshi (Tochigi, JP); Iwasaki; Yasuhiro (Tochigi, JP); Fukuzato; Kenshirou (Tochigi, JP); Zama; Tsutomu (Tochigi, JP); Noguchi; Koichi (Tochigi, JP); Okamura; Toshiro (Tochigi, JP); Yokoyama; Hiroyoshi (Tochigi, JP); Matuda; Youiti (Tochigi, JP). |
| Assignee: | Hitachi AIC Inc. (Tokyo, JP). |
| Appl. No.: | 768,426 |
| Filed: | Dec. 18, 1996 |
| Dec. 28, 1995 [JP] | 7-343761 |
| Jan. 22, 1996 [JP] | 8-008260 |
| Mar. 21, 1996 [JP] | 8-064197 |
| Aug. 23, 1996 [JP] | 8-222281 |
| Intl. Cl. : | H01K 3/10 |
| Current U.S. Cl.: | 29/852; 219/121.7; 219/121.71; 219/121.74; 427/97 |
| Field of Search: | 29/852; 219/121.7, 121.71, 121.74, 121.76; 427/97 |
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Printed Circuits Technical Handbook,chap. 4.10, Other Organic Insulation Substrate, section 4.10.1 Multilayer Board for Active Method Printed Circuits, p. 363, lines 7-9 (in Japanese).