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United States Patent 5,829,125
Fujimoto, et. al. Nov. 3, 1998

Method of manufacturing circuit module

Abstract

The present invention relates to a method of manufacturing a circuit module through the use of a wireless bonding technique. In this invention, in order to achieve component assembly without experiencing thermal and mechanical stresses, in the circuit module manufacturing method in which an external electrode of a component and a conductor of a substrate are connected with each other according to the wireless bonding technique, the substrate has a laser beam transmissible property, and after the component is placed on an assembly surface of the substrate, a laser beam is applied from a surface of the substrate opposite to the assembly surface thereof to a connecting spot. The laser beam passing through the substrate heats the connecting spot so that the connection between the external electrode of the component and the conductor of the substrate is made by phase transition or diffusion.


Inventors: Fujimoto; Masayuki (Tokyo, JP); Nakazawa; Matsuo (Tokyo, JP); Takahashi; Hiroshi (Tokyo, JP); Suzuki; Kazutaka (Tokyo, JP); Isuzuku; Koichiro (Tokyo, JP).
Assignee: Taiyo Yuden Co., Ltd. (Tokyo, JP).
Appl. No.: 698,163
Filed: Aug. 7, 1996

Foreign Application Priority Data
Aug. 8, 1995 [JP] 7-202092
Intl. Cl. : H05K 3/34
Current U.S. Cl.: 29/840; 219/121.64
Field of Search: 29/840; 219/121.63, 121.64

References Cited | [Referenced By]

U.S. Patent Documents
4,535,219Aug., 1985Sliwa 219/121.64 X
5,049,718Sept., 1991Spletter et al. 219/121.64
5,250,781Oct., 1993Kanda et al. 29/840 X
5,361,491Nov., 1994Oomachi et al. 29/840 X
5,405,809Apr., 1995Nakamura et al. 29/840 X
5,481,082Jan., 1996Yamamoto 219/121.64 X
5,495,089Feb., 1996Freedman et al. 219/121.64
5,500,502Mar., 1996Horita et al. 219/121.64 X
5,545,281Aug., 1996Matsui et al. 29/840 X
5,644,837Jul., 1997Fathi et al. 29/840 X

Primary Examiner: Johnson; Linda
Attorney, Agent or Firm: Lowe Hauptman Gopstein Gilman & Berner

22 Claims, 47 Drawing Figures

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