| United States Patent | 5,841,097 |
| Esaka, et. al. | Nov. 24, 1998 |
Abstract
Laser welding process and apparatus wherein a plurality of laser beams are focussed by a focussing device on surfaces of workpieces such that spots of the laser beams are located in the vicinity of an interface as viewed in a direction perpendicular to a direction of extension of an interface of the workpiece, and the beam spots and the workpieces are fed relative to each other by a feeding device in the direction of extension of the interface, while at the same time the beam spots are oscillated by an oscillating device at a predetermined frequency relative to the workpieces in a direction intersecting the direction of extension of the interface such that the beam spots are moved across the interface.
| Inventors: | Esaka; Fumikatsu (Toyota, JP); Takasago; Toshiyuki (Toyota, JP); Nishi; Eiji (Toyota, JP). |
| Assignee: | Toyota Jidosha Kabushiki Kaisha (JP). |
| Appl. No.: | 771,655 |
| Filed: | Dec. 23, 1996 |
| Dec. 27, 1995 [JP] | 7-340457 |
| Intl. Cl. : | B23K 26/06 |
| Current U.S. Cl.: | 219/121.63; 219/121.74; 219/121.77; 219/161.64 |
| Field of Search: | 219/121.63, 121.64, 121.73, 121.74, 121.75, 121.76, 121.77, 121.8 |
| 4,572,841 | Feb., 1986 | Sciaky et al. | 219/121.64 |
| 4,769,522 | Sept., 1988 | Lentz et al. | 219/121.63 |
| 5,138,490 | Aug., 1992 | Hohberg et al. | 219/121.74 |
| 5,155,323 | Oct., 1992 | Macken | 219/121.64 |
| 5,245,156 | Sept., 1993 | Kamogawa et al. | 219/121.64 |
| 5,303,081 | Apr., 1994 | Totsuka et al. | 219/121.74 |
| 5,410,123 | Apr., 1995 | Rancourt | 219/121.63 |
| 5,690,845 | Nov., 1997 | Fuse | 219/121.74 |
| 0 243 293 | Oct., 1987 | EP | |
| 54-101596 | Aug., 1979 | JP | 219/121.64 |
| 57-106489 | Jul., 1982 | JP | 219/121.64 |
| 60-240395 | Nov., 1985 | JP | 219/121.64 |
| 63-52788 | Mar., 1988 | JP | 219/121.64 |
| 1-143784 | Jun., 1989 | JP | 219/121.75 |
| 1-228689 | Sept., 1989 | JP | 219/121.77 |
| 4-182087 | Jun., 1992 | JP | 219/121.76 |
| 5-66281 | Mar., 1993 | JP |
Concise Explanation Under Rule 98 (1 page) of JP 5-66281.