| United States Patent | 5,841,102 |
| Noddin | Nov. 24, 1998 |
Abstract
A method for forming a through-via in a laminated substrate by laser drilling a through-via from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are spaced at the first pulse spacing. Each pulse spaced at the first pulse spacing has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned at a second pulse spacing. Each pulse spaced at the second pulse spacing has a second energy density per pulse. The second energy density per pulse is greater than the first energy density per pulse, and the second pulse spacing is less than the first pulse spacing.
| Inventors: | Noddin; David B. (Eau Claire, WI). |
| Assignee: | W. L. Gore & Associates, Inc. (Newark, DE). |
| Appl. No.: | 744,413 |
| Filed: | Nov. 8, 1996 |
| Intl. Cl. : | B23K 26/00 |
| Current U.S. Cl.: | 219/121.71; 216/17; 219/121.61; 219/121.85; 427/554 |
| Field of Search: | 219/121.61, 121.69, 121.7, 121.71, 121.72, 121.76, 121.77, 121.78, 121.85; 216/17, 65; 427/554, 555, 556, 96, 97; 264/400; 438/940 |
| 3,953,566 | Apr., 1976 | Gore | |
| 4,169,976 | Oct., 1979 | Cirri | 219/121.72 |
| 4,348,253 | Sept., 1982 | Subbarao et al. | |
| 4,445,978 | May, 1984 | Whartenby et al. | |
| 4,473,737 | Sept., 1984 | Anthony | |
| 4,482,516 | Nov., 1984 | Bowman et al. | |
| 4,547,836 | Oct., 1985 | Anthony | |
| 4,595,428 | Jun., 1986 | Anthony et al. | |
| 4,647,476 | Mar., 1987 | Anthony | |
| 4,705,762 | Nov., 1987 | Ota et al. | |
| 4,720,308 | Jan., 1988 | Anthony et al. | |
| 4,789,770 | Dec., 1988 | Kasner et al. | 219/121.7 |
| 4,839,497 | Jun., 1989 | Sankar et al. | 219/121.71 |
| 4,894,115 | Jan., 1990 | Eichelberger et al. | 216/17 X |
| 4,901,136 | Feb., 1990 | Neugebauer et al. | |
| 4,913,656 | Apr., 1990 | Gordon et al. | |
| 4,943,032 | Jul., 1990 | Zdeblick | |
| 4,959,119 | Sept., 1990 | Lantzer | |
| 4,985,296 | Jan., 1991 | Mortimer, Jr. | |
| 5,009,607 | Apr., 1991 | Gordon et al. | |
| 5,019,997 | May, 1991 | Haller | |
| 5,071,359 | Dec., 1991 | Arnio et al. | |
| 5,108,785 | Apr., 1992 | Lincoln et al. | |
| 5,126,532 | Jun., 1992 | Inagawa et al. | 219/121.7 |
| 5,171,964 | Dec., 1992 | Booke et al. | |
| 5,194,713 | Mar., 1993 | Egitto et al. | 219/121.71 |
| 5,224,265 | Jul., 1993 | Dux et al. | |
| 5,245,751 | Sept., 1993 | Locke et al. | |
| 5,251,097 | Oct., 1993 | Simmons et al. | |
| 5,293,025 | Mar., 1994 | Wang | |
| 5,293,626 | Mar., 1994 | Priest et al. | |
| 5,331,203 | Jul., 1994 | Wojnarowski et al. | |
| 5,355,397 | Oct., 1994 | Hanson et al. | |
| 5,377,404 | Jan., 1995 | Berg | |
| 5,378,313 | Jan., 1995 | Pace | |
| 5,378,318 | Jan., 1995 | Weling et al. | |
| 5,391,516 | Feb., 1995 | Wojnarowski et al. | |
| 5,428,803 | Jun., 1995 | Chen et al. | |
| 5,442,475 | Aug., 1995 | Bausman et al. | |
| 5,459,634 | Oct., 1995 | Nelson et al. | |
| 5,466,892 | Nov., 1995 | Howard et al. | |
| 5,509,553 | Apr., 1996 | Hunter, Jr. et al. | |
| 5,541,367 | Jul., 1996 | Swamy | |
| 5,541,731 | Jul., 1996 | Freedenberg et al. | |
| 5,593,606 | Jan., 1997 | Owen et al. | 219/121.71 |
| 5,595,668 | Jan., 1997 | Madden, Jr. et al. | 216/17 |
| 5,609,746 | Mar., 1997 | Farrar et al. | 216/17 X |
| 5,688,418 | Nov., 1997 | Yoshiyasu et al. | 219/121.71 |
| 59-27791 | Feb., 1984 | JP | 219/121.71 |
| 62-96091 | Apr., 1987 | JP | 219/121.71 |
| 1750900 | Jul., 1992 | SU | 219/121.7 |
| 86/02301 | Apr., 1986 | WO | 219/121.7 |
| WO 90/01374 | Feb., 1990 | WO |
"Precision Laser Machining: Drilling by Trepanning" Electo-Optical Systems Design, May 1973, pp. 31-33.
Kestenbaum et al., "Laser Drilling of Microvias in Epoxy-Glass Printed Circuit Boards" IEEE Trans. on Components, Hybrids, and Manufacturing Tech., vol. 13, No. 4, Dec. 1990, pp. 1055-1062.
Rohde et al., "Trepan drilling of fuel injection nozzles with a TEM00 Nd:YAG slab laser" Journal of Laser Applications, vol. 8, No. 2, Apr. 1996, pp. 95-101.
Article, Lizotte et al., "Laser drilling speeds BGA packaging", Solid State Technology, Sep. 1996, pp. 120-128.
Article, Eskew et al., "A Laser drill and patterning system for low cost, rapid prototyping", ICEMCM '95, pp. 314-319, 1995.
Brochure, "IMPACT--Laser Processing Systems", Lumonics Corporation, 4 pages, no date available.
Article, Tourne, "Laser Via Technologies for High Density MCM-L Fabrication", ICEMCM '95, pp. 71-76, 1995.
Article, Carey, "MCM-L Substrates for a 300 MHZ Workstation", ICEMCM '95, pp. 537-542, 1995.
Article, Patel et al., "Projection Laser Ablation Mask Alternatives", ICEMCM '95, pp. 320-326, 1995.
Technical Paper, Kosto et al., "Low Cost Through-Hole Activation Method for PTFE Based Substrates", IPC, pp. P6-5-1 through P6-5-8, May 1995.
Article, Jain et al., "Large-Area, High Throughout, High-Resolution Patternmaking and Via-Drilling System", ICEMCM '95, pp. 327-335, 1995.
Article, Lemke, "Recent Developments in the Production and Application of Advanced Laminate Based MCMs and Chip Carriers", ICEMCM '95, pp. 235-240, 1995.
Article, Freda et al. "Laminate Based Substrates in Semiconductor Packages", ICEMCM '95, pp. 559-566, 1995.