Abstract

A conductor pattern test apparatus comprises a DC voltage power source for applying a predetermined DC voltage to an end of one of a plurality of conductor patterns arranged in parallel with each other, a current measurement circuit for measuring a current flowing to another conductor pattern adjacent to the one of the conductor patterns via the end by the DC voltage power source to the end, and a short-circuit position calculation circuit for calculating a resistance value from the end to a short-circuited part of the two conductor patterns adjacent to each other, based on the current value measured by the current measurement circuit and the voltage value applied by the DC power source, and locating a position of the short-circuited part based on the calculated resistance value and a resistance value of a conductor pattern having no short-circuit. A disconnect location is also obtained.