| United States Patent | 6,419,148 |
| Waxler , et al. | July 16, 2002 |
A system and method for forming bumps on an integrated circuit including a scanning direct laser imager employed to selectably expose a photosensitive layer deposited on an integrated circuit substrate, thereby to define regions overlying selected portions of the substrate, a developer developing said photosensitive layer to form apertures in the photosensitive layer at the defined regions, and a solder applicator applying a solder composition to the apertures to define solder bumps on the integrated circuit at selected portions thereof.
| Inventors: | Waxler; Scott Steven (North Reading, MA); Zemer; Dan (Rehovot, IL) |
| Assignee: | Orbotech Ltd. (Yavne, IL) |
| Appl. No.: | 767645 |
| Filed: | January 23, 2001 |
| Current U.S. Class: | 228/214; 228/14; 219/121.7 |
| Intern'l Class: | B23K 026/00 |
| Field of Search: | 228/259,6.1,6.2,118,179.1,180.1,180.21,180.22,188,189,214,14,13 219/121.68,121.69,121.75,121.79,121.7 |
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| Foreign Patent Documents | |||
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