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United States Patent 6,420,676
Sawai ,   et al. July 16, 2002
Method for machining wiring board with laser beam and device for same

Abstract

A wiring board is machined by providing a light shielding body for shielding a portion of a laser beam in a light path between a laser oscillator and a machining lens, irradiating the laser beam onto the light shielding body, and introducing a non-shielded portion of the laser beam having passed through the light shielding body to the machining lens.

Inventors: Sawai; Hidekazu (Tokyo, JP); Kurosawa; Miki (Tokyo, JP); Matsubara; Masato (Tokyo, JP)
Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP)
Appl. No.: 734649
Filed: December 13, 2000
Foreign Application Priority Data
Oct 01, 1996[JP]8-260847

Current U.S. Class: 219/121.7
Intern'l Class: B23K 026/36
Field of Search: 219/121.67,121.68,121.69,121.7,121.71,121.72

References Cited
U.S. Patent Documents
3947093Mar., 1976Goshima et al.219/121.
4734550Mar., 1988Imamura et al.219/121.
4857698Aug., 1989Perun219/121.
5017755May., 1991Yahagi et al.219/121.
RE33947Jun., 1992Shinohara219/121.
5119550Jun., 1992Baughman et al.219/121.
5237148Aug., 1993Aoki et al.219/121.
5319183Jun., 1994Hosoya et al.219/121.
5386430Jan., 1995Yamagishi et al.219/121.
5486546Jan., 1996Mathiesen et al.522/165.
5657138Aug., 1997Lewis et al.219/121.
5670069Sep., 1997Nakai et al.219/121.
5721416Feb., 1998Nurghardt et al.219/121.
Foreign Patent Documents
572798Feb., 1976CH.
0500110Aug., 1992EP.
63-40690Feb., 1988JP.
3-193289Aug., 1991JP.
4-66288Mar., 1992JP.
5-390Jan., 1993JP.
5-147213Jun., 1993JP.
6-269969Mar., 1994JP.
07 100 685Apr., 1995JP.
07 193 374Jul., 1995JP.
7-214360Aug., 1995JP.
07 284 976Oct., 1995JP.
7-284976Oct., 1995JP.
10-15684Jan., 1998JP.
93/15911Aug., 1993WO.

Primary Examiner: Heinrich; Samuel M.
Attorney, Agent or Firm: Sughrue Mion, PLLC
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