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| United States Patent |
6,423,930
|
|
Matsumoto
|
July 23, 2002
|
Scribing with laser
Abstract
When lines of vertical cracks due to thermal strain are formed for a plate
made of a brittle material with a laser, the plate is irradiated with a
laser beam along first lines in a first direction, and thereafter along
second lines in a second direction crossing the first direction. When the
second lines are scribed, depths of the generated vertical cracks are
controlled to be shallower than those of the vertical cracks generated
along the first lines in the first direction. The scribing is controlled
by setting irradiation energy of the laser beam per unit area and per unit
time in the second direction to be lower than that in the first direction.
For example, moving speed of the laser spot relative to the plate is
varied or output power of the laser beam is controlled on the irradiation
energy.
| Inventors:
|
Matsumoto; Masato (Osaka-fu, JP)
|
| Assignee:
|
Mitsuboshi Diamond Industrial Co., Ltd. (Osaka-fu, JP)
|
| Appl. No.:
|
593928 |
| Filed:
|
June 15, 2000 |
Foreign Application Priority Data
| Jun 18, 1999[JP] | 11-172601 |
| Current U.S. Class: |
219/121.69; 65/112; 83/880; 225/2 |
| Intern'l Class: |
B23K 026/36 |
| Field of Search: |
219/121.67,121.68,121.69,121.7,121.71
65/112
83/880
225/2
|
References Cited
U.S. Patent Documents
| 5622540 | Apr., 1997 | Stevens | 219/121.
|
| 5776220 | Jul., 1998 | Allaire et al. | 219/121.
|
| 5826772 | Oct., 1998 | Ariglio et al. | 225/97.
|
| 5961852 | Oct., 1999 | Rafla-Yuan et al. | 219/121.
|
| Foreign Patent Documents |
| 93/20015 | Oct., 1993 | WO.
| |
Primary Examiner: Heinrich; Samuel M.
Attorney, Agent or Firm: Wenderoth, Lind & Ponack, L.L.P.
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