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| United States Patent |
6,423,934
|
|
Hasegawa
,   et al.
|
July 23, 2002
|
Method for forming through holes
Abstract
A method for forming through holes, which has laser beam as the light
source to project the laser beam to the work object using an optical
system through a photomask for the formation of through holes on the work
object by ablation processing, comprises the steps of increasing the
concentration of the optical processing energy contributing to the process
using the reflected beam created from the work object in the laser
ablation processing; and forming each of through holes having the
configuration enabling the narrower end to be changed to the wider end in
the incident direction of laser beam. With the structure thus arranged, it
becomes possible to increase the energy concentration that contributes to
the process as compared with the usual ablation processing, because the
reflected beam created in the ablation processing can be utilized again
for the optical processing. Then, each of the through holes can be formed
easily in the configuration in which the narrower end changes to the wider
end in the incident direction of laser beam, which cannot be easily
processed by the application of the usual ablation processing.
| Inventors:
|
Hasegawa; Toshinori (Yokohama, JP);
Ishimatsu; Shin (Yokohama, JP);
Koide; Jun (Yokohama, JP)
|
| Assignee:
|
Canon Kabushiki Kaisha (Tokyo, JP)
|
| Appl. No.:
|
315019 |
| Filed:
|
May 20, 1999 |
Foreign Application Priority Data
| May 20, 1998[JP] | 10-138653 |
| Jun 15, 1998[JP] | 10-166899 |
| May 17, 1999[JP] | 11-135658 |
| Current U.S. Class: |
219/121.71; 219/121.7; 219/121.69; 219/121.73; 219/121.68; 29/890.1 |
| Intern'l Class: |
B23K 026/00 |
| Field of Search: |
219/121.71,121.7,121.69,121.85,121.73,121.68
29/890.1
|
References Cited
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|
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|
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|
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|
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|
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|
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|
| Foreign Patent Documents |
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| |
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| |
| 2-187346 | Jul., 1990 | JP.
| |
Primary Examiner: Ryan; Patrick
Assistant Examiner: Elve; M. Alexandra
Attorney, Agent or Firm: Fitzpatrick, Cella, Harper & Scinto
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