[Back to the Laser Materials Processing Patent Collection]
| United States Patent |
6,441,337
|
|
Isaji
,   et al.
|
August 27, 2002
|
Laser machining method, laser machining device and control method of laser
machining
Abstract
This is to present a laser machining method and a laser machining apparatus
for drilling holes, capable of achieving conduction securely between
adjacent conductive layers, by detecting the machining state of a
workpiece adequately, and controlling the machining.
For this purpose, the number of laser pulse outputs capable of machining
securely is preset. During laser machining, reflected laser beam intensity
from the workpiece and incident laser beam intensity are detected, and the
machining state of the workpiece is detected. As a result, when judging
the workpiece has reached a desired machining state, laser machining is
finished if the number of times of laser machining has not reached the set
number of laser pulse outputs. If it is judged that the workpiece has not
reached the desired machining state, laser machining is finished when
reaching the set number of laser pulse outputs. As a result, the laser
machining method and laser machining apparatus capable of drilling holes
of high quality at high yield and shortening the machining cycle time can
be realized.
| Inventors:
|
Isaji; Kazuhide (Osaka, JP);
Karasaki; Hidehiko (Ashiya, JP);
Kinoshita; Hisashi (Katano, JP);
Kato; Makoto (Kawasaki, JP)
|
| Assignee:
|
Matsushita Electric Industrial Co., Ltd. (Osaka, JP)
|
| Appl. No.:
|
367343 |
| Filed:
|
August 11, 1999 |
| PCT Filed:
|
December 10, 1998
|
| PCT NO:
|
PCT/JP98/05583
|
| 371 Date:
|
August 11, 1999
|
| 102(e) Date:
|
August 11, 1999
|
| PCT PUB.NO.:
|
WO99/30864 |
| PCT PUB. Date:
|
May 24, 1999 |
Foreign Application Priority Data
| Dec 12, 1997[JP] | 9-342453 |
| May 08, 1998[JP] | 10-125682 |
| Current U.S. Class: |
219/121.62; 219/121.83; 219/121.85 |
| Intern'l Class: |
B23K 026/04 |
| Field of Search: |
219/121.62,121.83,121.85,121.81,121.78,121.61,121.6
|
References Cited
U.S. Patent Documents
| 5063280 | Nov., 1991 | Inagawa et al.
| |
| Foreign Patent Documents |
| 2-92482 | Apr., 1990 | JP.
| |
| 3-124387 | May., 1991 | JP.
| |
| 4-37494 | Feb., 1992 | JP.
| |
| 4-45593 | Feb., 1992 | JP.
| |
| 6-277863 | Oct., 1994 | JP.
| |
| 50-22395 | Mar., 1995 | JP.
| |
| 10-113781 | May., 1998 | JP.
| |
Primary Examiner: Elve; M. Alexandra
Attorney, Agent or Firm: RatnerPrestia
[Back to the Laser Materials Processing Patent Collection]