[Back to the Laser Materials Processing Patent Collection]
| United States Patent |
6,441,339
|
|
Ueno
|
August 27, 2002
|
Apparatus for manufacturing circuit modules
Abstract
A manufacturing method of circuit modules comprising steps of melting a
solder on a land by an energy of irradiating laser beam, and pressing an
external electrode of an electronic component to a melted solder before
the melted solder hardens. This method is capable of connecting the
electrode of the component to the land of the substrate using the solder
sufficiently heated and melted. A manufacturing apparatus of circuit
modules comprises an adsorbing nozzle which adsorbs an electronic
component and mounts it on a substrate, an optical system which projects
laser beams to a solder preliminarily applied to an electrode of a
substrates, and a control device which controls a component mounting and a
laser beam irradiation so that the electrode of the electronic component
is pressed to the solder melted by an energy of a irradiating laser beam
before the melted solder hardens. This apparatus is capable of connecting
the component with the above laser beam while controlling the component
mounting and the laser beam irradiation.
| Inventors:
|
Ueno; Mitsuo (Tokyo, JP)
|
| Assignee:
|
Taiyo Yuden Co., Ltd. (Tokyo, JP)
|
| Appl. No.:
|
667675 |
| Filed:
|
September 22, 2000 |
Foreign Application Priority Data
| Apr 04, 1997[JP] | HP9-86279 |
| Current U.S. Class: |
219/121.65; 219/124.4; 219/125.1; 219/129 |
| Intern'l Class: |
B23K 026/00 |
| Field of Search: |
219/121.85,121.65,124.4,125.1,129,121.6
|
References Cited
U.S. Patent Documents
| 5023426 | Jun., 1991 | Prokosch et al. | 219/121.
|
| 5227604 | Jul., 1993 | Freedman.
| |
| 5406701 | Apr., 1995 | Pepe et al.
| |
| 5601737 | Feb., 1997 | Asahi et al. | 219/121.
|
Primary Examiner: Elve; M. Alexandra
Attorney, Agent or Firm: Lowe Hauptman Gilman & Berner, LLP
[Back to the Laser Materials Processing Patent Collection]