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| United States Patent |
6,448,533
|
|
Kanayama
|
September 10, 2002
|
Method of repairing disconnected wiring and multilevel wiring structure
Abstract
A method of repairing a disconnected wiring, which has a step of connecting
a main wiring in which disconnection is caused and a spare wiring which is
formed on or under the main wiring via an interlayer insulating film in
their intersecting region of the main and spare wirings, comprising the
steps of opening a hole by irradiating a laser beam of a first output
intensity from a laser to the intersecting region of the main wiring and
the spare wiring, and connecting the spare wiring and the main wiring by
melting a part of the spare wiring and the main wiring by irradiating a
laser beam of a second output intensity, which is different from the first
output intensity, toward the hole.
| Inventors:
|
Kanayama; Yasufumi (Tottori, JP)
|
| Assignee:
|
Fujitsu Limited (Kawasaki, JP)
|
| Appl. No.:
|
425464 |
| Filed:
|
October 22, 1999 |
Foreign Application Priority Data
| Oct 30, 1998[JP] | 10-310273 |
| Oct 14, 1999[JP] | 11-292546 |
| Current U.S. Class: |
219/121.64; 219/121.71 |
| Intern'l Class: |
B23K 026/20; B23K 026/38; G09F 009/35 |
| Field of Search: |
219/121.64,121.67,121.7,121.71,121.72
228/119
|
References Cited
U.S. Patent Documents
| 5466908 | Nov., 1995 | Hosoya et al. | 219/121.
|
| 5506499 | Apr., 1996 | Puar | 29/847.
|
| 6180993 | Jan., 2001 | Wang et al. | 257/529.
|
| 6222156 | Apr., 2001 | Datta | 219/121.
|
| 6255144 | Jul., 2001 | Jeon et al. | 438/131.
|
| Foreign Patent Documents |
| 63183481 | Jul., 1988 | JP.
| |
Primary Examiner: Heinrich; Samuel M.
Attorney, Agent or Firm: Greer, Burns & Crain, Ltd.
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