| United States Patent | 6,454,987 |
| Katoh , et al. | September 24, 2002 |
A laminated substrate is prepared, the laminated substrate having two layers including a first film and a second film in tight contact with the first film, the second film being made of a material capable of being etched with synchrotron radiation light. A mask member with a pattern is disposed in tight contact with the surface of the second film of the laminated structure or at a distance from the surface of the second film, the pattern of the mask member being made of a material not transmitting the synchrotron radiation light. The synchrotron radiation light is applied on a partial surface area of the second film via the mask member to etch the second film where the synchrotron radiation light is applied and to expose a partial surface area of the first film on the bottom of an etched area.
| Inventors: | Katoh; Takanori (Kusatsu, JP); Zhang; Yanping (Kusatsu, JP) |
| Assignee: | Sumitomo Heavy Industries, Inc. (Tokyo, JP) |
| Appl. No.: | 602273 |
| Filed: | June 23, 2000 |
| Jun 19, 1997[JP] | 9-163148 |
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Copy of Office Action and English translation dated Jan. 22, 2002 issued by the Japanese Patent Office in connection with a counterpart Japanese patent application No. 9-163148. The Transactions of the Institute of Electrical Engineers of Japan, a publication of Electronics, Information and Systems Society, vol. 116, Dec. 1996, pp. 1341-1347 (English translation not available). Zhang et al, "Synchrotron Radiation Micromachining of Polymers to Produce High-Aspect-Ratio Microparts", Japanese Journal of Applied Physics, JP, Publication Office Japanese Journal of Applied Physics, Tokyo, vol. 35, Part 2, Mo. 2A, pp. L186-L188 XP000730588, ISSN: 0021-4922--entire document. Zhang et al, "High Aspect Ratio Micromachining Teflon by Direct Exposure to Synchrotron Radiation", Applied Physics Letters, U.S., American Institute of Physics, New York, vol. 67, No. 6, pp. 872-874, XP000674181, ISSN: 0003-6951--entire document. |